Copper-manganese alloys are widely known for their quality and reliability. They are used in a wide range of demanding applications, mainly due to their dielectric properties.
Their advantages are mainly the possibility to achieve a very thin residual resistance on the final component, a high stability of the resistance over a wide temperature range and the possibility to miniaturise components by choosing low resistance types. Copper and manganese form homogeneous alloys at contents up to about 20 % Mn. These materials are oxygen-free due to the deoxidising effect of the manganese and are therefore insensitive to reducing gases even at high temperatures.
The manganese additions increase the tensile strength of the copper both at room temperature and at higher temperatures. The softening temperatures of CuMn2 and CuMn5 are around 400°C to 450°C. However, the conductivity is greatly reduced by manganese. Compared to copper, these alloys have an increased corrosion resistance to many media.
Copper-manganese alloys also have a higher resistance to deformation than unalloyed copper due to their higher strength. With an index of 20 %, the machinability is similar to that of pure copper. The materials can be perfectly soft and hard soldered and also welded very well because they are oxygen-free and have low thermal conductivity.
Cu-Mn alloys are particularly suitable as materials for general and chemical apparatus engineering and as alloys for ship boilers due to their temperature and corrosion resistance.
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